9号彩票

硬件主任工程师-xPON Hardware Advisory Engineer - PBA

岗位编号:FNRDJ1301315724
职位类别:通信技术
发布日期:2013-04-16
部门名称:FNRD
工作地点:上海金桥
工作经验:五年以上
最低学历:大学本科
招聘对象:有工作经验
职位描述:
参见英文要求
Job Description:

Responsibilities:
1. Understanding of high-speed digital hardware design, CPU, memory, packet-based switching circuit, Wifi, power management and analog design to develop new and exciting board products;
2. Create board level schematics, select appropriate cost-effective components and generate BOMs; Define PCB layout rules and review work of PCB designers on an ongoing basis;
3. Bring-up and debug board design and fully test functionality and performance; Review designs and provide guidance to 3rd party OEMs;
4. Provide strong technical support and failure analysis to manufacturing and field issues;
5. Good coordination ability to work with NPI team, mechanical team, engineering supporting team and software team, as well as 3rd party supply chain providers;
6. Complete design and test documents during corresponding development stages;
7. Act as a mentor, to provide coaching and assistance to junior HW design engineers;(for Advisory position)
职位要求:
参见英文要求
1. Education background: Bachelor 7yr+, Master 5yr+
Bachelor or above in Electrical Engineering or equivalent related degree;
2. Working experience: 5+ years of successful Fix Access Product Hardware Design experience. This experience should have included end-to-end delivery in a time-to-market environment, as well as a solid understanding of the product lifecycle process as well as the hardware development process;
3. Specific Skills, knowledge and competencies:
a) Working experience on xPON OLT/ONT is preferred. Such as DSL modem, home gateway, wifi-router, etc.;
b) Familiar with cost-effective designs and components, able to utilize local low cost eco-system;
c) Familiarity with Telecom-related standards such as ETSI, NEBS, Telcordia and EUED-RoHS, as well as a good understanding of Ethernet, IP, Optics (PON) and POTS;
d) Direct experience dealing with New Product Introduction (NPI) teams and facilities;
e) Direct experience dealing with product Root Cause Analysis for manufacturing and field support;
f) Direct experience dealing with external suppliers and OEM vendors;
g) High degree of familiarity with circuit and PLD design/simulation tools;
4. General competencies:
a) Good communication skills;
b) Initiative, high teamwork spirit;
c) High responsibility, dedication and team spirit; High ability of studying, self-motivated and ability of working independently;
5. Language Ability: Fluent in both oral and written English;
6. Plus: Experience in HDS, BSP, driver, boot and embedded software development is preferred. (for Advisory position)

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