9号彩票

硬件主任工程师-HW Thermal Design Engineer

岗位编号:WLPDJ1301315423
职位类别:通信技术
发布日期:2013-01-26
部门名称:WLPD
工作地点:上海金桥
工作经验:五年以上
最低学历:大学本科
招聘对象:有工作经验
是否需要出差:是
职位描述:

Responsibility
1.Perform thermal/cooling analysis, simulation, design, and verification for
PBA/Rack/Shell level system.
2.Technical suggestion to PBA/Mechanics designers from the thermal view.
3.New thermal/cooling technology/strategy introduction for design team
4.Configuration management of Thermal and Mech. data.
5.Contribute to HW product optimization from Mechanics/Thermal point of view.
6.Work closely with manufacture and product manager to define prototype
building strategy. Lead the execution of the builds and issue resolution

职位要求:

Requirements:
1.3-5+ years HW experiences, with 3+ years in Thermal design
2.Skillful in thermal analysis tool, Flowtherm is preferred
3.Solid knowledge on cooling route, thermal dynamics, heat transfer and
aerodynamics
4.Experiences of cooling system in telecom product is preferred
5.Language: CET-6
6.Major:Thermal / Power Engineering


R&D Competency:
1.Technical:
-EPON/GPON, ONT/OLT
-Mechanics
-Thermal analysis/design
-ETSI, MII, ANSI Compliance test and certification
-Knowledge of Access Networking fundamentals, such as xDSL, POTS, PON and
Access Gateway
2.Tools:Flowtherm, Pro/E,
3.Behavior:
-Be able to co-ordinate tasks among different teams, both inside and
outside of engineering team
-Open mind, Good team work spirit
-self motivated, ability to work independently with minimal supervision
-Accountable
-Strong learning desire and good self-study ability

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